The company's specializations

• Semiconductor Equipment – Material growth and epitaxy, lithography equipment, plasma systems, thin film deposition, thermal processing equipment, automation solutions, and more.
• Nanotechnology Equipment – Nano-fabrication and 3D printing, carbon nanotubes, 2D materials, scanning electron microscopy (SEM), focused ion beam SEM (FIB-SEM), micro-computed tomography (Micro-CT), atomic force microscopy (AFM), and more.
• Analytical Equipment – SEM, FIB-SEM, Micro-CT, probe stations, ellipsometry and optical tools, semiconductor metrology (CV/IV, resistivity, carrier lifetime/mobility), AFM, nano-testers, ion beam etching (IBE) analysis tools, and more.
• Assembly and Testing Equipment – High Accuracy Die & Flip Chip bonding equipment, Probe stations, plasma cleaning and activation, thermal processing equipment, and more.
• Optics & Precision Materials – Optical coating tools (IBD, DLC), atomic layer deposition (ALD) systems, and optical coating materials.